Founded in 1992, Transys now owns and operates a full capability 5000 square foot power semiconductor waferfab along with vacuum soldering assembly capability. They are capable of producing 4,000, 4, 5, and 8-inch power semiconductor wafers per week.
The key product technologies include IGBT’s, customised MOSFET’s, Power Transistors and Transient Voltage Suppressors (TVS).
Considerable investment in both key personnel and equipment has kept Transys ahead of the technological curve, even in an industry that boasts much larger companies.
They have a full range of processing capability, Diffusion for both Planar and Mesa products, both advanced and Ion implantation and more rugged Gas and Film dopants are used, Photolithography, plasma and chemical etch, plus sputtering and evaporated metal systems and dicing all onsite in the UK.
Astute Contact: Stewart Burns [email protected]
The transhield negative slope device consists of multiple Die soldered together inside a package to achieve the current rating. The above current ratings relate to the stack of chips & not a single die.
Over the last 29 years we have developed some truly world beating products, unheard of for a private company our size. Partnering with Astute we are expanding on our historic customer base, Astute’s unmatched experience as a design led distributor creates a perfect partnership between the two companies
Christian Holland, Managing Director, Transys Electronics
As do many semiconductor companies, Transys subcontracts much of the discrete assembly of their die to specialist partners at various locations in Asia.
However, as some of their customers require more, Transys maintain a high-value packaging solution division at their UK HeadQuarters.
This division uses exclusively vacuum soldering systems plus a range of wirebond systems to attach die into power modules of various types and sizes.